Precautions for cleaning the PCB and drying?

For large-scale production, engineers also need to remember the cleaning process when designing PCB boards. There are some trade-offs to consider when designing component layout, soldering, and cleaning. For high-density surface mount assemblies, designers should provide room for cleaning. Here are some design choices worth considering:

1. The best direction of the component

2. The smallest obstacle below the jetting element

3. Use of high energy injectors for cleaning chemicals

4. Use of fine spray for scouring (liquid particles are smaller than the space between the component and the layer)

5. Elimination of "shadow", the higher component is placed farthest from the spray nozzle, the smallest component is closest

6. Component placement: Passive chip components (or cylindrical via) should be oriented such that their long axes are perpendicular to the spray direction. Double-row and small-pin integrated circuit (SOIC) components are placed on long edge spray lines